MEMS production,wafer cutting

Numéro d’image : 11895078
MEMS production,wafer cutting
MEMS production. Machine being used to cut up a silicon wafer of MEMS (microelectromechanical systems) devices. The liquid provides lubrication during the cutting process. MEMS devices are constructed on a microscopic scale using technologies such as wet and dry etching and thin film deposition. Applications include sensors and optical displays. Materials used to construct MEMS devices include silicon and polymers such as plastics. Photographed at an INEX facility. INEX is a British microsystems and nanotechnology company that was founded in 2002
Licence : Droits gérés
Crédit: Science Photo Library / Cuthbert, Colin
Taille de l’image : 4064 px × 2704 px
Model Release : Non requis
Property Release : Non requis
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