Technician using tweezers to position the wire leads used in the autobonding stage of fabrication of integrated circuits (silicon chips). Autobonding refers to the attachment of wire leads from pads around the rectangular chip to the surrounding lead frame - part of the chip's packaging which houses the pins that connect to a circuit board. The unbonded circuits (visible below the tweezers) are mounted on a microscope stage during autobonding; a television camera mounted over the microscope displays the delicate operation. Photographed at Seagate Microelectronics Ltd.,Livingston,Scotland | |
Licence : | Droits gérés |
Crédit: | Science Photo Library / SEAGATE MICROELECTRONICS LTD / DAVID PARKER |
Taille de l’image : | 3305 px × 2616 px |
Model Release : | Le droit n'est pas encore disponible. Merci de nous contacter avant utilisation. |
Property Release : | Non requis |
Restrictions : | - |